All equipment supports integrated in-house production, for example, automatic plating lines, multilayer press machines, etc. are prerequisite to shorting set up times.From making a single prototype we deliver product development in a short time, supporting all the steps to low-cost mass production.

Strict Quality Control Through AOI	High Level Technology, Capable of High Density Wiring	Accepting Orders from Prototypes to Mass Production
High Precision Etching with Ferric Chloride-based Solution	Vertical Carrier Jet Type Fully Automatic Plating Ensures High Level Uniformity in Mass Production	High Speed / High Accuracy PWB Automatic Inspection

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  Data Editing
  Editing of Garber data sent from clients, creating working films as well as NC data / Router Data etc.
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  Inner Layer Process
  Carrying out Inner layer pattern formation / etching inspection / blackening etc.
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  Vacuumed Multilayer Pressing
  Combining several inner plates to form a vacuum while pressing and applying heat from the oil heater.
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  Holing
  NC machines make holes (holes for inserting components and holes for electrical continuity).
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  Smear Removal
  Smear removal of epoxide resin generated when holing.
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  Copper Plating
  Copper plating is applied to the whole PWB surface (outer surface and inner hole walls) to electrically connect the front and back.
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  Hole Plugging
  When etching, in order to protect the copper plating in the holes from the etching solution, resin is embedded within the holes and hardened with UV.
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  Belt Grinding
  Smoothing of the surface to maximize adhesion of the etching resist.
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  Pattern Formation
  As an etching resist, dry film is laminated, then light exposure and developing are done.
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  Etching
  Other than the desired conductor pattern protected by the etching resist, unnecessary copper foil parts will be removed by the etching solution.
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  Intermediate Inspection (by AOI)
  Scanning the pattern optically, we inspect for the presence or absence of defects (breaks, short circuits, cracks, thick and thin circuits etc.).
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  Solder Mask
  When soldering electronic devices etc., permanent masking of the surface pattern for the purpose of protecting it from the external environment and to prevent soldering of unnecessary parts.
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  Symbol Mark Printing
  Printing of the position of parts to be mounted, the product name etc.
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  Surface Treatment
  Protecting copper foil areas on the surface of the PWB where resist is not applied.
  The methods are; Pb-free, Solder Leveling, OSP, and Gold Plating.
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  Blanking and Routing
  Blanking and routing with an NC router or a mold press.
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  Test
  •Dedicated jig: Conducts continuity test for mass production products.
  •Flying Probe Tester: Conducts continuity test by a moving probe for prototypes and small lot production products.
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  Inspection / Delivery
  The appearance etc. is checked, and items that pass inspection are packed into a box and delivered to the destination specified by the customer.

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  Laser Direct Imaging(LDI) system
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  Vacuumed Multilayer Press System
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  NC Drilling Machine
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  Sulfuric Acid Copper Plating System
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  Inkjet / Symbol Mark Printing System
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  Flying Probe Tester